Description
Our thermal CPU paste improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink – a high quality solution that helps to ensure maximum dissipation of heat generated by the CPU
- Better thermal conductivity over standard silicon-based compounds and negligible electrical conductivity for effective and safe use in high performance applications
- Metal-based compound containing metal oxide
- Thermal conductivity of more than 1.93 W/m-K
- Negligible electrical conductivity
- Stable performance over a wide temperature range
- 4-6 applications per tube
- Resealable syringe applicator
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